VOID-TEK Ground Heave Protection Brochure

Ground heave is the upward movement of the ground surface caused by the expansion of clay soils when they absorb water. It can damage structures and infrastructure if not properly managed. Conventional solutions often include the introduction of a polystyrene cellular structure, or void former. But there are multiple disadvantages to using these including the product being bulky, easy to damage, harmful to the environment and running the risk of excessive waste. Enter... VOID-TEK technology to alleviate these issues! Created to target pain points on site, VOID-TEK allows for reduced dig, saving labour and muck away costs, arrives flat-packed reducing transport costs, and is polystyrene FREE and high strength - reducing crushing and snapping.